Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17954837
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Filing Dt:
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09/28/2022
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Publication #:
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Pub Dt:
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10/05/2023
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Inventors:
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Ho-Ming TONG, Chao-Chun LU
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Title:
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DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F., NO. 22, LN. 35, JIHU RD., NEIHU DIST. |
| TAIPEI CITY, TAIWAN 114754 |
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| NO. 6, TECHNOLOGY ROAD 5 |
| HSINCHU, TAIWAN 300 |
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| BIRCH STEWART KOLASCH & BIRCH LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
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05/09/2024 08:38 AM
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