Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18024832
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Filing Dt:
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03/06/2023
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Publication #:
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Pub Dt:
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10/05/2023
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Inventors:
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Masaaki NOZAKI, Yuji TANAKA, Shu MATSUURA, Yousuke NAKAMURA
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Title:
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HEATSINK, METHOD FOR MANUFACTURING HEATSINK, AND ELECTRONIC COMPONENT PACKAGE USING SAID HEATSINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-10 NIHONBASHIKOAMI-CHO, CHUO-KU |
| TOKYO, JAPAN 1030016 |
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| GREENBLUM & BERNSTEIN P.L.C |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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