Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18189356
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Filing Dt:
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03/24/2023
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Publication #:
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Pub Dt:
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10/12/2023
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Inventors:
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Masashi TAKAHASHI, Atsushi CHIBA
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Title:
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SUBSTRATE PROCESSING APPARATUS AND COVER RING ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-4-8 SHINYOKOHAMA, KOUHOKU-KU |
| YOKOHAMA, JAPAN 222-8575 |
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| RABIN & BERDO, P.C. |
| 2650 PARK TOWER DRIVE, SUITE 800 |
| VIENNA, VA 22180 |
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