Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18209398
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Filing Dt:
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06/13/2023
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Publication #:
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Pub Dt:
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10/12/2023
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Inventors:
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Tatsuro HITOMI, Yasuhito YOSHIMIZU, Masayuki MIURA, Arata INOUE, Hiroyuki DOHMAE et al
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Title:
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WAFER AND PROBER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-21, SHIBAURA 3-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 108-0023 |
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| MAIER & MAIER PLLC |
| 345 SOUTH PATRICK STREET |
| ALEXANDRIA, VA 22314 |
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