Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18334625
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Filing Dt:
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06/14/2023
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Publication #:
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Pub Dt:
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10/12/2023
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Inventors:
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Noboru NAGASE, Ippei KAWAMOTO, Toshihiro FUJITA, Atsushi SAITO, Hideki KABUNE
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Title:
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SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| POSZ LAW GROUP, PLC |
| 12040 SOUTH LAKES DRIVE |
| SUITE 101 |
| RESTON, VA 20191 |
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04/28/2024 03:58 AM
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