Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18022101
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Filing Dt:
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02/17/2023
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Publication #:
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Pub Dt:
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10/12/2023
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Inventors:
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Mika SHINODA, Hiroki HIRAI, Yuta SAEGUSA, Kazunori TOGASHI
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Title:
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THERMALLY-CROSSLINKABLE LOW MOLECULAR WEIGHT COMPOUND-CONTAINING COMPOSITION FOR LIGHT EMITTING DIODE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-9-2, HIGASHI-SHIMBASHI, MINATO-KU |
| TOKYO, JAPAN 1050021 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP. |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
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