Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18025337
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Filing Dt:
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03/08/2023
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Publication #:
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Pub Dt:
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10/19/2023
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Inventors:
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Hiroki OTA, Yuki NAKANO
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Title:
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WAFER POLISHING METHOD AND WAFER POLISHING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2-1 SHIBAURA, MINATO-KU |
| TOKYO, JAPAN 105-8634 |
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| GREENBLUM & BERNSTEIN, P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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05/04/2024 05:51 AM
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