Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18245347
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Filing Dt:
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03/15/2023
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Publication #:
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Pub Dt:
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10/19/2023
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Inventors:
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Shunsuke OTAKE, Kazuyuki MITSUKURA, Shinji SHIMAOKA, Hiroaki FUJITA, Masaki TAKAHASHI
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Title:
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METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-9, SHIBA DAIMON 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-8518 |
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| SOEI USA INC. |
| 1750 TYSONS BLVD, SUITE 1500 |
| MCLEAN, VA 22102 |
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Assignment:
2
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| 9-1, HIGASHI-SHIMBASHI 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-7325 |
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| ALAN E. SCHIAVELLI |
| SUITE 2100 |
| 120 SOUTH LASALLE STREET |
| CHICAGO, IL 60603 |
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05/08/2024 09:50 PM
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