Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17899983
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Filing Dt:
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08/31/2022
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Publication #:
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Pub Dt:
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10/19/2023
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Inventors:
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Hyeg Soon AN, Hui Sun PARK, Jeong Wook SEO, Tae Hyung KIM, Hee Sun CHUN, Hyo Ju LEE et al
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Title:
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MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MORGAN, LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE, NW |
| WASHINGTON, DC 20004 |
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