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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18338730
Filing Dt:
06/21/2023
Publication #:
Pub Dt:
10/19/2023
Inventors:
Te-Chih HSIUNG, Jyun-De WU, Peng WANG, Huan-Just LIN
Title:
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
064201/0325Recorded: 07/10/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/22/2021
Exec Dt:
03/22/2021
Exec Dt:
03/22/2021
Exec Dt:
03/22/2021
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD
FALLS CHURCH, VA 22042

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