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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18336100
Filing Dt:
06/16/2023
Publication #:
Pub Dt:
10/19/2023
Inventors:
Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze et al
Title:
EXTRA DOPED REGION FOR BACK-SIDE DEEP TRENCH ISOLATION
Assignment: 1
Reel/Frame:
063971/0780Recorded: 06/16/2023Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/30/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/28/2015
Exec Dt:
10/30/2015
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
ESCHWEILER & POTASHNIK, LLC
3500 MASSILLON ROAD
SUITE 420
UNIONTOWN, OH 44685

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