Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17723665
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Filing Dt:
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04/19/2022
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Publication #:
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Pub Dt:
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10/19/2023
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Inventors:
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Jianbo Zhou, Shiang Yang Ong, Namchil Mun, Hung Chang Liao, Zhongxiu Yang
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Title:
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DEEP TRENCH ISOLATION STRUCTURES WITH A SUBSTRATE CONNECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D |
| STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| THOMPSON HINE LLP |
| 10050 INNOVATION DRIVE |
| SUITE 400 |
| MIAMISBURG, OH 45342-4934 |
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