Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18042813
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Filing Dt:
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02/24/2023
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Publication #:
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Pub Dt:
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10/19/2023
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Inventors:
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Hironobu YAMAMOTO, Toshinari KOBAYASHI, Yukitoshi TERASAKA, Kyungwoo KIM
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Title:
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MOLDED CONNECTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-14, NISHISUEHIRO-CHO |
| YOKKAICHI-SHI, MIE, JAPAN 5108503 |
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| HONIGMAN LLP |
| 650 TRADE CENTRE WAY |
| SUITE 200 |
| KALAMAZOO, MI 49002-0402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-14, NISHISUEHIRO-CHO |
| YOKKAICHI-SHI, MIE, JAPAN 5108503 |
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| HONIGMAN LLP |
| 650 TRADE CENTRE WAY |
| SUITE 200 |
| KALAMAZOO, MI 49002-0402 |
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04/28/2024 01:41 PM
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