Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18215929
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Filing Dt:
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06/29/2023
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Publication #:
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Pub Dt:
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10/26/2023
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Inventors:
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Md Hasnine, Lik Wai Kho
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Title:
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HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS IN EXTREME ENVIRONMENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 155 HARLEM AVENUE |
| GLENVIEW, ILLINOIS 60025 |
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| STINSON LLP |
| 7700 FORSYTH BOULEVARD, SUITE 1100 |
| ST. LOUIS, MO 63105 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 800 W. THORNDALE AVE. |
| ITASCA, ILLINOIS 60143 |
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| STINSON LLP |
| 7700 FORSYTH BOULEVARD, SUITE 1100 |
| ST. LOUIS, MO 63105 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 245 FREIGHT STREET |
| WATERBURY, CONNECTICUT 06702 |
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| STINSON LLP |
| 7700 FORSYTH BOULEVARD, SUITE 1100 |
| ST. LOUIS, MO 63105 |
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05/28/2024 03:08 AM
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