Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17727495
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Filing Dt:
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04/22/2022
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Publication #:
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Pub Dt:
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10/26/2023
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Inventors:
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Kevin Ryan, Hirokazu Aizawa, Kaoru Maekawa, Satohiko Hoshino, Yoshihiro Tsutsumi
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Title:
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METHOD FOR FORMING SEMICONDUCTOR PACKAGES USING DIELECTRIC ALIGNMENT MARKS AND LASER LIFTOFF PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AKASAKA BIZ TOWER |
| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET NW |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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