Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18138050
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Filing Dt:
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04/22/2023
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Publication #:
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Pub Dt:
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10/26/2023
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Inventors:
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Bryan Black, Siddharth Ravichandran, Michael Su, Michael Alfano
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Title:
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Through Package Vertical Interconnect and Method of Making Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1114 CLIFFVIEW DR |
SPICEWOOD, TEXAS 78669 |
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ARTIE PENNINGTON LAW OFFICES, PLLC |
154 ELMHURST DR |
STE B |
KYLE, TX 78640 |
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05/10/2024 05:11 AM
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