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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17883073
Filing Dt:
08/08/2022
Publication #:
Pub Dt:
10/26/2023
Inventors:
Jaemyung CHOI, Tae Sun KIM, Janggeun LEE, Kang-ill SEO
Title:
INTERCONNECT STRUCTURE OF SEMICONDUCTOR DEVICE INCLUDING METAL PATTERN OR VIA STRUCTURE WITH SIDEWALL SPACER STRUCTURE
Assignment: 1
Reel/Frame:
060746/0026Recorded: 08/08/2022Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/05/2022
Exec Dt:
08/04/2022
Exec Dt:
08/05/2022
Exec Dt:
08/04/2022
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF 16677
Correspondent:
SUGHRUE MION, PLLC.
2000 PENNSYLVANIA AVENUE, N.W.
9TH FLOOR
WASHINGTON, DC 20006

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