Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17727504
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Filing Dt:
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04/22/2022
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Publication #:
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Pub Dt:
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10/26/2023
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Inventors:
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Chih-Yu LAI, Chih-Liang CHEN, Chi-Yu LU, Chung-Hsing WANG
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Title:
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SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA AND METHOD OF MAKING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAUPTMAN HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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