Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18017970
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Filing Dt:
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01/25/2023
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Publication #:
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Pub Dt:
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11/02/2023
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Inventors:
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Toru MAEDA, Miki MIYANAGA, Daisuke KONDO, Masayuki ITO, Shin-ichi YAMAGATA
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Title:
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COMPOSITE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI |
| OSAKA, JAPAN 541-0041 |
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| 11-11, SHIBA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-0014 |
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| RENNER OTTO |
| 1621 EUCLID AVENUE |
| 19TH FLOOR |
| CLEVELAND, OH 44115 |
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