Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17730765
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Filing Dt:
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04/27/2022
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Publication #:
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Pub Dt:
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11/02/2023
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Inventor:
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Thomas Dungan
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Title:
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MACROCHIP WITH INTERCONNECT STACK FOR POWER DELIVERY AND SIGNAL ROUTING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| BROADCOM/SUITER SWANTZ PC LLO |
| 14301 FNB PARKWAY, SUITE 220 |
| OMAHA, NE 68154 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE CHANGE FROM: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED TO : BROADCOM INTERNATIONAL PTE. LTD.. PREVIOUSLY RECORDED AT REEL: 059742 FRAME: 0832. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| ADSERO IP |
| 8210 SOUTHPARK TERRACE |
| LITTLETON, CO 80120 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, NW |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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