Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/12/2024
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Application #:
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18300329
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Filing Dt:
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04/13/2023
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Publication #:
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Pub Dt:
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11/02/2023
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Inventors:
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MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy
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Title:
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Innovative Interconnect Design for Package Architecture to Improve Latency
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 INNOVATION DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| ANGELA MILLER |
| C/O CLARIVATE |
| P.O. BOX 5427 |
| TUCSON, AZ 85703 |
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05/27/2024 05:16 AM
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