Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18347067
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Filing Dt:
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07/05/2023
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Publication #:
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Pub Dt:
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11/02/2023
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Inventors:
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Hsi-Cheng HSU, Jui-Chun WENG, Ching-Hsiang HU, Ji-Hong CHIANG, Kuo-Hao LEE, Chia-Yu LIN et al
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Title:
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WAFER BONDING ALIGNMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HARRITY & HARRITY LLP |
| 11350 RANDOM HILLS RD. |
| SUITE 600 |
| FAIRFAX, VA 22030 |
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