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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18141497
Filing Dt:
05/01/2023
Publication #:
Pub Dt:
11/02/2023
Inventor:
Alexander Roth
Title:
Semiconductor Package Comprising a Combined Power and Logic Substrate
Assignment: 1
Reel/Frame:
063674/0789Recorded: 05/17/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/02/2023
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959

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