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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/30/2024
Application #:
17730913
Filing Dt:
04/27/2022
Publication #:
Pub Dt:
11/02/2023
Inventors:
Yi-Chieh CHEN, Ching-Yi SHIH, Yueh-Chang WU, Kang HSU
Title:
SYSTEMS AND METHODS FOR HEAT DISSIPATION IN COMPUTING SYSTEMS WITH ENVIRONMENT RESISTANCE
Assignment: 1
Reel/Frame:
059810/0500Recorded: 04/27/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/26/2022
Exec Dt:
04/26/2022
Exec Dt:
04/26/2022
Exec Dt:
04/26/2022
Assignee:
NO. 188, WENHUA 2ND RD., GUISHAN DIST.
TAOYUAN CITY, TAIWAN 33383
Correspondent:
NIXON PEABODY LLP
70 W. MADISON STREET
SUITE 5200
CHICAGO, IL 60602

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