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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18341063
Filing Dt:
06/26/2023
Publication #:
20230356321
Pub Dt:
11/09/2023
Inventors:
Osamu TAKAKUWA, Hisao MATSUNAGA, Takahiro ISHIKAWA, Hiromitsu UCHIYAMA et al
Title:
COPPER ALLOY ASSEMBLY AND PRODUCTION METHOD THEREFOR
Assignment: 1
Reel/Frame:
064147/0202Recorded: 07/05/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TAKAKUWA, OSAMU
Exec Dt:
03/01/2023
MATSUNAGA, HISAO
Exec Dt:
03/01/2023
ISHIKAWA, TAKAHIRO
Exec Dt:
06/15/2023
UCHIYAMA, HIROMITSU
Exec Dt:
06/08/2023
SAKAKIBARA, MASATO
Exec Dt:
06/08/2023
AKAIWA, MASAAKI
Exec Dt:
06/13/2023
Assignees:
KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
744, MOTOOKA, NISHI-KU
FUKUOKA-SHI, FUKUOKA, JAPAN 819-0395
NGK INSULATORS, LTD.
2-56, SUDA-CHO, MIZUHO-KU
NAGOYA-CITY, AICHI-PREFECTURE, JAPAN 467-8530
Correspondent:
STEPHEN P. BURR
BURR PATENT LAW, PLLC
P.O. BOX 869
FAYETTEVILLE, NY 13066

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