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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18246364
Filing Dt:
03/23/2023
Publication #:
Pub Dt:
11/09/2023
Inventors:
Sung-Tso Lin, Ching-Yi Liu, Ying-Yuh Lu, Wei-Cheng Su
Title:
ACRYLAMIDE OR (METH)ACRYLAMIDE-CONTAINING HIGH TG ADDITIVE FOR PRESSURE SENSITIVE ADHESIVES
Assignment: 1
Reel/Frame:
063073/0637Recorded: 03/23/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/14/2021
Exec Dt:
12/20/2021
Exec Dt:
12/07/2021
Exec Dt:
12/14/2021
Assignee:
P.O. BOX 33427
SAINT PAUL, MINNESOTA 55133-3427
Correspondent:
3M INNOVATIVE PROPERTIES COMPANY
P.O. BOX 33427
SAINT PAUL, MN 55133-3427

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