Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18246364
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Filing Dt:
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03/23/2023
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Publication #:
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Pub Dt:
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11/09/2023
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Inventors:
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Sung-Tso Lin, Ching-Yi Liu, Ying-Yuh Lu, Wei-Cheng Su
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Title:
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ACRYLAMIDE OR (METH)ACRYLAMIDE-CONTAINING HIGH TG ADDITIVE FOR PRESSURE SENSITIVE ADHESIVES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 33427 |
| SAINT PAUL, MINNESOTA 55133-3427 |
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| 3M INNOVATIVE PROPERTIES COMPANY |
| P.O. BOX 33427 |
| SAINT PAUL, MN 55133-3427 |
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