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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18247013
Filing Dt:
03/28/2023
Publication #:
Pub Dt:
11/09/2023
Inventors:
Yuki Yoshiya, Takuya Hoshi, Hiroki Sugiyama, Hideaki Matsuzaki
Title:
SEMICONDUCTOR MULTILAYER STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
063133/0981Recorded: 03/28/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/08/2021
Exec Dt:
02/08/2021
Exec Dt:
02/08/2021
Exec Dt:
02/05/2021
Assignee:
5-1, OTEMACHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8116
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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