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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17930858
Filing Dt:
09/09/2022
Publication #:
Pub Dt:
11/09/2023
Inventors:
Kensuke ISHIKAWA, Fumitaka AMANO, Shingo TOTANI, Linghan CHEN
Title:
BONDED ASSEMBLY CONTAINING BONDING PADS WITH METAL OXIDE BARRIERS AND METHODS FOR FORMING THE SAME
Assignment: 1
Reel/Frame:
061046/0309Recorded: 09/09/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/08/2022
Exec Dt:
09/08/2022
Exec Dt:
09/09/2022
Exec Dt:
09/09/2022
Assignee:
5080 SPECTRUM DRIVE
SUITE 1050W
ADDISON, TEXAS 75001
Correspondent:
THE MARBURY LAW GROUP, PLLC
11800 SUNRISE VALLEY DRIVE
15TH FLOOR
RESTON, VA 20191

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