Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18341498
|
Filing Dt:
|
06/26/2023
|
|
Publication #:
|
|
Pub Dt:
|
11/09/2023
| | | | |
|
Inventors:
|
Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Felix Ying-Kit Tsui, Chien-Li Kuo
|
|
Title:
|
Low Warpage High Density Trench Capacitor
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| HAYNES AND BOONE, LLP |
| 2323 VICTORY AVENUE |
| DALLAS, TX 75219 |
|
|
Search Results as of:
05/14/2024 11:11 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
