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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18316882
Filing Dt:
05/12/2023
Publication #:
20230366707
Pub Dt:
11/16/2023
Inventors:
Addis Tessema, John Perraut, McKevin Veloso, Paul Roehm, Jonathan M. Cabot et al
Title:
SENSOR-EMBEDDED COMPOSITES
Assignment: 1
Reel/Frame:
066054/0228Recorded: 01/08/2024Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TESSEMA, ADDIS
Exec Dt:
10/31/2023
PERRAUT, JOHN
Exec Dt:
10/31/2023
VELOSO, MCKEVIN
Exec Dt:
11/15/2023
ROEHM, PAUL
Exec Dt:
11/03/2023
CABOT, JONATHAN M.
Exec Dt:
10/31/2023
LERMAN, MICHAEL
Exec Dt:
11/23/2023
LARSON, SCOTT
Exec Dt:
12/29/2023
IMMANI, SATYA
Exec Dt:
11/06/2023
Assignee:
TPI COMPOSITES, INC.
373 MARKET STREET
WARREN, RHODE ISLAND 02885
Correspondent:
FOLEY HOAG LLP
155 SEAPORT BLVD.
BOSTON, MA 02210-2600
Assignment: 2
Reel/Frame:
066014/0207Recorded: 12/14/2023Pages: 13
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
TPI COMPOSITES, INC.
Exec Dt:
12/14/2023
Assignee:
OAKTREE FUND ADMINISTRATION, LLC
333 S. GRAND AVENUE, 28TH FL.
LOS ANGELES, CALIFORNIA 90071
Correspondent:
RAFFAELE A. DEMARCO
125 BROAD STREET
SULLIVAN & CROMWELL LLP
NEW YORK, NY 10004-2498

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