Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18196314
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Filing Dt:
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05/11/2023
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Publication #:
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Pub Dt:
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11/16/2023
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Inventor:
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Kiyohito SHIMURA
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Title:
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Packing material-containing microcolumn
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-6-48-402, NODA-MACHI, FUKUSHIMA-SHI |
| FUKUSHIMA, JAPAN 960-8055 |
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| NAKANISHI IP ASSOCIATES, LLC |
| 6929 SUNRISE BLVD. SUITE 102D |
| CITRUS HEIGHTS, CA 95610 |
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05/10/2024 10:51 AM
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