Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18359070
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Filing Dt:
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07/26/2023
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Publication #:
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Pub Dt:
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11/16/2023
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Inventors:
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Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu et al
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Title:
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Low-Resistance Interconnect
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAYNES AND BOONE, LLP. |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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05/26/2024 01:11 AM
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