Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17740413
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Filing Dt:
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05/10/2022
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Publication #:
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Pub Dt:
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11/16/2023
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Inventors:
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Marcus Boehm, Michael Fuegl, Ludwig Heitzer, Stefan Woetzel
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Title:
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MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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| MURPHY, BILAK & HOMILLER, PLLC |
| PO BOX 1959 |
| CARY, NC 27572-1959 |
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05/11/2024 12:08 PM
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