Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17745363
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Filing Dt:
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05/16/2022
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Publication #:
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Pub Dt:
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11/16/2023
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Inventors:
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JUSTIN C. HACKLEY, JEFFREY DAVID HARTMAN
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Title:
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BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2980 FAIRVIEW PARK DRIVE |
| FALLS CHURCH, VIRGINIA 22042-4511 |
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| TAROLLI, SUNDHEIM, COVELL & TUMMINO LLP |
| 1300 EAST NINTH STREET |
| SUITE 1700 |
| CLEVELAND, OH 44114 |
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