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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
06/11/2024
Application #:
18351437
Filing Dt:
07/12/2023
Publication #:
Pub Dt:
11/16/2023
Inventors:
Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley et al
Title:
FLEXIBLE INTERCONNECT CIRCUITS AND METHODS OF FABRICATION THEREOF
Assignment: 1
Reel/Frame:
064233/0661Recorded: 07/12/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/22/2023
Exec Dt:
02/22/2023
Exec Dt:
02/22/2023
Exec Dt:
02/22/2023
Exec Dt:
02/22/2023
Exec Dt:
02/22/2023
Assignee:
610 QUARRY RD.
SAN CARLOS, CALIFORNIA 94070
Correspondent:
POLYGON IP, LLP
101 JEFFERSON DRIVE
MENLO PARK, CA 94025
Assignment: 2
Reel/Frame:
067166/0404Recorded: 04/18/2024Pages: 17
Conveyance:
NOTICE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY
Assignor:
Exec Dt:
04/18/2024
Assignee:
388 GREENWICH STREET
NEW YORK, NEW YORK 10013
Correspondent:
JUSTINE LU/WHITE & CASE LLP
555 SOUTH FLOWER STREET, SUITE 2700
LOS ANGELES, CA 90071

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