Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17907053
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Filing Dt:
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09/22/2022
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Publication #:
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Pub Dt:
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11/23/2023
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Inventors:
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Hui Wang, Hongchao Yang, Jian Wang, Zhaowei Jia
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Title:
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PLATING APPARATUS AND PLATING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BLD. 4, NO.1690, CAILUN ROAD |
| ZHANGJIANG HIGH-TECH PARK |
| SHANGHAI, CHINA 201203 |
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| JEFFREY S. BERGMAN |
| ENTERPRISE PLAZA STE 4900, 1100 LOUISIANA ST |
| HOUSTON, TX 77002 |
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