Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18319452
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Filing Dt:
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05/17/2023
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Publication #:
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Pub Dt:
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11/23/2023
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Inventors:
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Jackson Fernandez Rosario, Enrique E. Sarile Jr, Dzafir Bin Mohd Shariff et al
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Title:
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BACK SURFACE PLASMA DICED WAFERS AND METHODS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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22 ANG MO KIO INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569506 |
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HORIZON IP PTE LTD |
7500A BEACH ROAD |
#15-322 THE PLAZA |
SINGAPORE, 199591 SINGAPORE |
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05/31/2024 01:19 AM
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