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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18365402
Filing Dt:
08/04/2023
Publication #:
Pub Dt:
11/23/2023
Inventors:
Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih-Pei Chou, Yu-Hung Cheng et al
Title:
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
Assignment: 1
Reel/Frame:
064494/0018Recorded: 08/04/2023Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/21/2018
Exec Dt:
09/21/2018
Exec Dt:
09/21/2018
Exec Dt:
09/27/2018
Exec Dt:
09/21/2018
Exec Dt:
09/21/2018
Exec Dt:
09/21/2018
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
ESCHWEILER & POTASHNIK, LLC
195 S. MAIN ST., SUITE 400
AKRON, OH 44308

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