Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17891634
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Filing Dt:
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08/19/2022
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Publication #:
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Pub Dt:
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11/23/2023
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Inventors:
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Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng, Ying-Ching Shih, Hung-Yu Chen
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Title:
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INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
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