Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18364314
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Filing Dt:
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08/02/2023
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Publication #:
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Pub Dt:
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11/23/2023
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Inventors:
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Robin Davis, Timothy L. Olson, Craig Bishop, Clifford Sandstrom
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Title:
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FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV) VERTICAL INTERCONNECTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7855 SOUTH RIVER PARKWAY |
| SUITE 205 |
| TEMPE, ARIZONA 85284 |
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| RILEE THERIAULT |
| 1255 W RIO SALADO PKWY |
| SUITE 215 |
| TEMPE, AZ 85281 |
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