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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18352835
Filing Dt:
07/14/2023
Publication #:
Pub Dt:
11/23/2023
Inventors:
Mr. Jia-Zhe Liu, Chih-Yuan Chuang, Po Jung Lin, Hong Che Lin
Title:
NOVEL BUFFER LAYER STRUCTURE TO IMPROVE GAN SEMICONDUCTORS
Assignment: 1
Reel/Frame:
066171/0833Recorded: 01/18/2024Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/08/2023
Exec Dt:
07/10/2023
Exec Dt:
07/08/2023
Exec Dt:
07/04/2023
Assignee:
NO. 8 INDUSTRY E. RD II
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 30075
Correspondent:
JEFFREY S BERGMAN
1100 LOUISIANA STREET
ENTERPRISE PLAZA STE 4900
HOUSTON, TX 77002

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