Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18104982
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Filing Dt:
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02/02/2023
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Publication #:
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Pub Dt:
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11/30/2023
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Inventors:
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Chih-cheng WANG, Zong-en WU, Yun-cheng CHIU
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Title:
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INTEGRATED WAFER DEBONDING AND CLEANING APPARATUS AND DEBONDING AND CLEANING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 89, SEC. 6, ZHONGHUA RD., XIANGSHAN DIST. |
HSINCHU CITY, TAIWAN 30095 |
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THE ROY GROSS LAW FIRM, LLC |
101 MERRITT 7 |
SUITE 300 |
NORWALK, CT 06851 |
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05/29/2024 08:59 AM
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