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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17664727
Filing Dt:
05/24/2022
Publication #:
Pub Dt:
11/30/2023
Inventor:
Saravana Maruthamuthu
Title:
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS
Assignment: 1
Reel/Frame:
060117/0069Recorded: 06/07/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/06/2022
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121-1714
Correspondent:
W&T/QUALCOMM
106 PINEDALE SPRINGS WAY
CARY, NC 27511

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