Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18447968
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Filing Dt:
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08/10/2023
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Publication #:
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Pub Dt:
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11/30/2023
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Inventors:
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De-Yang CHIOU, Yu-Yun Peng, Fu-Ting Yen, Keng-Chu Lin
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Title:
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Storage Layers For Wafer Bonding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C |
| 1101 K STREET, N.W., 10TH FLOOR |
| WASHINGTON, DC 20005 |
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