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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18446755
Filing Dt:
08/09/2023
Publication #:
Pub Dt:
11/30/2023
Inventors:
Hui-Hsien WEI, Yen-Chung HO, Chia-Jung YU, Yong-Jie WU, Pin-Cheng HSU
Title:
MOBILITY ENHANCEMENT BY SOURCE AND DRAIN STRESS LAYER OR IMPLANTATION IN THIN FILM TRANSISTORS
Assignment: 1
Reel/Frame:
064536/0692Recorded: 08/09/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/10/2022
Exec Dt:
01/25/2022
Exec Dt:
01/17/2022
Exec Dt:
01/03/2022
Exec Dt:
01/03/2022
Assignee:
NO. 8, LI-HSIN 6 ROAD
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN ROC 30077
Correspondent:
THE MARBURY LAW GROUP, PLLC
11800 SUNRISE VALLEY DRIVE
15TH FLOOR
RESTON, VA 20191

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