Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18257146
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Filing Dt:
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06/13/2023
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Publication #:
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Pub Dt:
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12/07/2023
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Inventors:
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Shuichi ISHIBASHI, Daisuke FUJIMOTO, Tomohiko KOTAKE
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Title:
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METHOD FOR EVALUATING COMPATIBILITY OF THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-9, SHIBA DAIMON 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 1058518 |
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| FITCH, EVEN, TABIN & FLANNERY, LLP |
| 120 SOUTH LASALLE STREET, SUITE 2100 |
| CHICAGO, IL 60603-3406 |
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Assignment:
2
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| 9-1, HIGASHI-SHIMBASHI 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-7325 |
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| ALAN E. SCHIAVELLI |
| SUITE 2100 |
| 120 SOUTH LASALLE STREET |
| CHICAGO, IL 60603 |
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