Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17829719
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Filing Dt:
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06/01/2022
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Publication #:
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Pub Dt:
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12/07/2023
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Inventors:
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Yangming Liu, Shenghua Huang, Bo Yang, Ning Ye
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Title:
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MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5601 GREAT OAKS PARKWAY |
| SAN JOSE, CALIFORNIA 95119 |
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| MICHAEL BEST & FRIEDRICH LLP |
| 790 N. WATER STREET |
| SUITE 2500 |
| MILWAUKEE, WI 53202 |
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Assignment:
2
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PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT
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| 10 S. DEARBORN L2 |
| CHICAGO, ILLINOIS 60603 |
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| CT CORPORATION |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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Assignment:
3
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PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT
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| 10 S. DEARBORN L2 |
| CHICAGO, ILLINOIS 60603 |
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| CT CORPORATION |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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