Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18014272
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Filing Dt:
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07/14/2023
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Publication #:
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Pub Dt:
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12/07/2023
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Inventors:
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Akira FUKUI, Toshie FUKUI
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Title:
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BONDING MEMBER FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4F, CLOTO BUILDING, 376, ICHINOFUNAIRI-CHO |
KAWARAMACHI-DORI, NIJYO-SAGARU, NAKAGYO-KU |
KYOTO-SHI, KYOTO, JAPAN 604-0924 |
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PETER T. EWALD |
OLIFF PLC |
P.O. BOX 320850 |
ALEXANDRIA, VA 22320-4850 |
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05/06/2024 04:00 PM
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