Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18203792
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Filing Dt:
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05/31/2023
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Publication #:
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Pub Dt:
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12/14/2023
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Inventors:
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Hiroki HORIGOME, Shoichi OSADA, Norifumi KAWAMURA, Ryuhei YOKOTA, Kenji HAGIWARA
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Title:
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RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED SURFACE OF SUBSTRATE WITH SEMICONDUCTOR ELEMENT MOUNTED THEREON OR SEMICONDUCTOR ELEMENT-FORMING SURFACE OF WAFER WITH SEMICONDUCTOR ELEMENT FORMED THEREON, AND USE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1000005 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
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