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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17805951
Filing Dt:
06/08/2022
Publication #:
Pub Dt:
12/14/2023
Inventors:
SeungHyun Lee, HeeSoo Lee
Title:
Semiconductor Device and Method for Advanced Thermal Dissipation
Assignment: 1
Reel/Frame:
060138/0091Recorded: 06/08/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/08/2022
Exec Dt:
06/08/2022
Assignee:
5 YISHUN STREET 23
SINGAPORE, SINGAPORE 768442
Correspondent:
PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C.
123 W. CHANDLER HEIGHTS ROAD, #12535
CHANDLER, AZ 85248

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